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Under-FET Thermal Sensor Enabling Smart Full-Chip Run-Time Thermal Management
IEEE Journal of the Electron Devices Society ( IF 2.0 ) Pub Date : 2020-09-08 , DOI: 10.1109/jeds.2020.3022730
Cheng Li , Qi Chen , Feilong Zhang , Mengfu Di , Zijin Pan , Fei Lu , Albert Wang

This article reports design, fabrication and analysis of a novel under-transistor (under-FET) in-hole thermal sensor diode structure. Being able to accurately monitor self-heating of individual transistor in-operando, the under-FET temperature sensor enables smart full-chip run-time thermal management with spatial resolution down to single transistor level. The in-hole thermal sensors were fabricated in a CMOS process and validated in measurements. The new chip level thermal management technique was demonstrated using a prototype power amplifier (PA) IC designed in a foundry 40nm CMOS. It opens a door for self-learning based full-chip real-time intelligent thermal management for future ICs.

中文翻译:


FET 下热传感器支持智能全芯片运行时热管理



本文报告了一种新型晶体管下 (FET 下) 孔内热传感器二极管结构的设计、制造和分析。 FET 下温度传感器能够准确监控操作中各个晶体管的自发热,可实现智能全芯片运行时热管理,空间分辨率低至单个晶体管级别。孔内热传感器采用 CMOS 工艺制造,并在测量中进行验证。新的芯片级热管理技术通过采用代工 40nm CMOS 设计的原型功率放大器 (PA) IC 进行了演示。为未来IC基于自学习的全芯片实时智能热管理打开了一扇大门。
更新日期:2020-09-08
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