Sn–(58-x) Bi–x Cu/P ternary alloys were prepared by downward continuous casting, and the microstructure of the alloy was characterized using scanning electron microscopy (SEM), x-ray diffractometry (XRD) and differential scanning calorimetry (DSC). The results show that the addition of Cu and P can refine the eutectic structure and form rod-shaped Cu₆Sn₅ and P₃Sn₄ phases distributed in Sn matrix. The refined eutectic structure can be observed in Sn–(58-x) Bi–x Cu/P alloys, and this results in the elongation at break increases up. In addition, the wettability of Sn–58Bi alloy increases on Cu substrate with the addition of Cu and P elements. The improvement of the wettability of Sn–58Bi alloy by the addition of Cu element can be attributed to the increase of Cu-Sn IMC nucleation and growth rate. The addition of P element in Sn–58Bi alloy can improve its anti-oxidation performance, which is beneficial to the improvement of its wettability.

通过向下连续铸造制备Sn-（58-x）Bi-x Cu / P三元合金，并使用扫描电子显微镜（SEM），x射线衍射（XRD）和差示扫描量热法（ DSC）。结果表明，添加铜和磷可以改善共晶组织，形成棒状的Cu ₆ Sn ₅和P ₃ Sn _4。相分布在锡矩阵中。在Sn–（58-x）Bi–x Cu / P合金中可以观察到精细的共晶结构，这导致断裂伸长率增加。此外，通过添加Cu和P元素，Sn-58Bi合金在铜基底上的润湿性增加。通过添加Cu元素改善Sn-58Bi合金的润湿性可归因于Cu-Sn IMC成核和生长速率的增加。在Sn–58Bi合金中添加P元素可以改善其抗氧化性能，这有助于改善其润湿性。