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Resveratrol-Based Fluorinated Materials with High Thermostability and Good Dielectric Properties at High Frequency
ACS Sustainable Chemistry & Engineering ( IF 7.1 ) Pub Date : 2020-11-05 , DOI: 10.1021/acssuschemeng.0c06061
Linxuan Fang 1, 2, 3 , Yangqing Tao 1, 2, 3 , Caiyun Wang 1, 2 , Menglu Dai 1, 2, 3 , Gang Huang 1, 2, 3 , Jing Sun 1, 2 , Qiang Fang 1, 2
Affiliation  

Two resveratrol-based monomers with thermo-cross-linkable trifluorovinyl-ether groups (−OCF═CF2) have been designed and synthesized. After treating at a temperature above 140 °C, the monomers were converted into cross-linked networks, which display the average dielectric constants (Dk) of 2.45–2.52 and the average dielectric loss (Df) of 2.2 × 10–3 to 2.6 × 10–3 at a high frequency of 5 GHz. Such data are much better than these of the resveratrol-based epoxy resin (Dk of above 3.5 and Df of near 2.6 × 10–2) and the commercial bisphenol A epoxy resins (Dk of above 3.7). In addition, two cured monomers exhibit high thermostability with a 5% weight loss temperature (T5d) of more than 450 °C. They also display low water uptake of below 0.08% when immersed in boiling water for 3 days. These data indicate that the resveratrol-based monomers in this contribution are suitable as the encapsulation resins for the application in the microelectronic industry.

中文翻译:

具有高热稳定性和高频介电性能的白藜芦醇基氟化材料

与热交联性三氟-醚基团(-OCF═CF两个基于白藜芦醇的单体2)已经被设计和合成。在高于140℃的温度下处理后,单体转化成的交联网络,其显示的平均介电常数(d ķ的2.45-2.52)和平均介电损耗(d ˚F的2.2×10)-3至在5 GHz的高频下为2.6×10 –3。这样的数据比白藜芦醇基环氧树脂(D k大于3.5和D f接近2.6×10 -2)和市售双酚A环氧树脂(D k高于3.7)。此外,两种固化的单体在5%的失重温度(T 5d)超过450°C时表现出高的热稳定性。将它们浸泡在沸水中3天后,其吸水率也低于0.08%。这些数据表明,该贡献中的白藜芦醇基单体适合用作微电子工业中的封装树脂。
更新日期:2020-11-16
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