Ball grid array (BGA) packages have increasing applications in mobile phones, disk drives, LC displays and automotive engine controllers. However, the thermo-mechanical reliability of the BGA solder joints challenges the device functionality amidst component and system miniaturisation as well as wider adoption of lead-free solders. This investigation determines the effective BGA solders for improved thermo-mechanical reliability of the devices. It utilised a conducted study on creep response of a lead-based eutectic Sn63Pb37 and four lead-free Tin–Silver–Copper (SnAgCu) [SAC305, SAC387, SAC396 and SAC405] solders subjected to thermal cycling loadings and isothermal ageing. The solders form the joints between the BGAs and printed circuit boards (PCBs). ANSYS R19.0 package is used to simulate isothermal ageing of some of the assemblies at − 40°C, 25°C, 75°C and 150°C for 45 days and model the thermal cycling history of the other assemblies from 22°C ambient temperature for six cycles. The response of the solders is simulated using the Garofalo-Arrhenius creep model. Under thermal ageing, SAC396 solder joints demonstrate possession of least strain energy density, deformation and von Mises stress in comparison to the other solders. Under thermal cycle loading conditions, SAC405 acquired the lowest amount of the damage parameters in comparison. Lead-free SAC405 and SAC387 joints accumulated the lowest and highest energy dissipation per cycle, respectively. It is concluded that SAC405 and SAC396 are the most effective solders for BGA in devices experiencing isothermal ageing and temperature cycling during operation, respectively. They are proposed as the suitable replacement of eutectic Sn63Pb37 solder for the various conditions.

球栅阵列（BGA）封装在移动电话，磁盘驱动器，LC显示器和汽车发动机控制器中的应用不断增加。然而，在组件和系统小型化以及无铅焊料的广泛采用中，BGA焊点的热机械可靠性对设备功能提出了挑战。这项研究确定了用于提高器件热机械可靠性的有效BGA焊料。它利用了对铅基共晶Sn63Pb37和四种无铅锡银铜（SnAgCu）[SAC305，SAC387，SAC396和SAC405]焊料在热循环载荷和等温时效下的蠕变响应进行的研究。焊料形成了BGA与印刷电路板（PCB）之间的连接点。ANSYS R19.0软件包用于模拟某些组件在− 40°C下的等温老化，在25°C，75°C和150°C下放置45天，并在22°C环境温度下对其他组件的热循环历史进行建模，进行六个循环。使用Garofalo-Arrhenius蠕变模型模拟了焊料的响应。在热老化下，与其他焊料相比，SAC396焊点具有最小的应变能密度，变形和von Mises应力。相比之下，在热循环载荷条件下，SAC405获得的损伤参数最低。无铅SAC405和SAC387接头在每个循环中分别消耗最低和最高能量。结论是，SAC405和SAC396分别是在操作过程中经历等温老化和温度循环的器件中BGA的最有效焊料。