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Analysis of transient thermoelastic temperature distribution of a thin circular plate and its thermal deflection under uniform heat generation
Journal of Thermal Stresses ( IF 2.6 ) Pub Date : 2020-11-03 , DOI: 10.1080/01495739.2020.1828009
Kishor R. Gaikwad 1 , Yogesh U. Naner 2
Affiliation  

Abstract Analysis of transient thermoelastic temperature distribution of a thin circular plate and its thermal deflection under uniform internal heat generation is investigated. The upper and lower surfaces are thermally insulated, while the perimetric surface is subjected to convection heat transfer with convection coefficient hc and fluid temperature while the plate is also subjected to uniform internal energy generation g0 (W.m–3). The integral transform method is used to obtain the analytical solution for the temperature field and thermal deflection. As a special case, the mathematical model is prepared for copper material, and temperature distribution is analyzed for two different initial conditions. The results for temperature changes and the thermal deflection are computed numerically and illustrated graphically.

中文翻译:

薄圆板瞬态热弹性温度分布及其均匀发热下的热变形分析

摘要 研究了薄圆板的瞬态热弹性温度分布及其在均匀内生热下的热变形。上下表面是绝热的,而周边表面受到对流系数 hc 和流体温度的对流换热,而板也受到均匀的内能产生 g0 (Wm-3)。积分变换方法用于获得温度场和热偏转的解析解。作为特例,针对铜材料建立了数学模型,分析了两种不同初始条件下的温度分布。温度变化和热变形的结果以数字方式计算并以图形方式说明。
更新日期:2020-11-03
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