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Multiphysics modeling of ultrasonic elastic wave attenuation for wireless power transfer including viscoelasticity and acoustic emission
Mechanics Research Communications ( IF 1.9 ) Pub Date : 2020-11-01 , DOI: 10.1016/j.mechrescom.2020.103600
Joshua J. Radice , Victor Farm-Guoo Tseng , Trevon Drummond , Daniel Diamond , Natalie Schieuer , Sarah Bedair

Abstract A COMSOL Multiphysics model is developed to computationally predict power attenuation in an ultrasonic elastic wave wireless power transfer application. This model invokes the complete equations of elastodynamics, coupled electric field and piezoelectric elastic response, and coupled transmitter and receiver circuits. Structural damping is captured in the adhesive layers by treating them as isotropic viscoelastic media with complex valued elastic moduli. Structural damping is captured in the parent structure by modeling the acoustic emission from the exposed surfaces which couples the displacement field of the parent structure with the surrounding fluid medium. This model quantitatively predicts the electrical power transduction efficiency to within 5% over a range of excitation frequencies. This model is also able to predict the voltage gain to between 10-25% over the same range of excitation frequencies.

中文翻译:

用于无线电力传输的超声弹性波衰减的多物理场建模,包括粘弹性和声发射

摘要 开发了一个 COMSOL Multiphysics 模型来计算预测超声弹性波无线电力传输应用中的功率衰减。该模型调用了弹性动力学、耦合电场和压电弹性响应以及耦合发射器和接收器电路的完整方程。通过将粘合剂层视为具有复数值弹性模量的各向同性粘弹性介质,可以在粘合剂层中捕获结构阻尼。通过对暴露表面的声发射进行建模,将母体结构的位移场与周围流体介质耦合,从而在母体结构中捕获结构阻尼。该模型在一定的激励频率范围内定量预测电力转换效率在 5% 以内。
更新日期:2020-11-01
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