Combining Sub-nanometer Adhesion and Capping Layers for Thermally Stable Nanometer-Thick Au Films,ACS Applied Nano Materials

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Combining Sub-nanometer Adhesion and Capping Layers for Thermally Stable Nanometer-Thick Au Films
ACS Applied Nano Materials ( IF 5.3 ) Pub Date : 2020-11-02 , DOI: 10.1021/acsanm.0c01836
William M. Abbott ₁ , Christopher P. Murray ₁ , Frank Bello ₁ , Chuan Zhong ₁ , Christopher Smith ₁ , Cormac McGuinness ₁ , Daniyar Mamyraimov ₁ , Amanda K. Petford-Long _{2,

3} , David McCloskey ₁ , John F. Donegan ₁

Affiliation

Improving the thermal stability of Au thin films is critical if thermo-plasmonic applications such as heat-assisted magnetic recording are to become commercially viable. In this work, Al capping layers are deposited on M/Au films, where adhesion metal M = Ti or Ta, and are investigated for their utility in stabilizing Au thin films against dewetting. Contrary to previous investigations, it was found that thinner capping layers (0.5 nm) result in a greater stability than that conferred by thicker (1–5 nm) layers. Deposition of 0.5 nm of Al, which subsequently oxidizes when exposed to air, resulted in up to 10× stability enhancement. Similarly, capping with 0.5 nm Al resulted in less damping of the plasmonic response than with thicker capping layers. Finally, based on this work and previous work on metallic adhesion layers, optimally stable systems for thermo-plasmonic applications are proposed.

中文翻译：

结合亚纳米粘合层和覆盖层，形成热稳定的纳米厚金膜

如果热等离子体应用（例如热辅助磁记录）要在商业上可行，那么提高Au薄膜的热稳定性至关重要。在这项工作中，将Al覆盖层沉积在M / Au膜上，其中粘附金属M = Ti或Ta，并研究了它们在稳定Au薄膜抗湿润性方面的效用。与先前的研究相反，发现较薄的覆盖层（0.5 nm）比较厚的覆盖层（1-5 nm）具有更高的稳定性。沉积0.5 nm的Al，暴露在空气中随后会氧化，从而提高了10倍的稳定性。类似地，与较厚的覆盖层相比，用0.5 nm Al覆盖对等离子体响应的阻尼较小。最后，根据这项工作和先前有关金属粘合层的工作，

更新日期：2020-11-25

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