In 2005, Dennard Scaling which had hitherto delivered the performance enhancement of IC Chips completely collapsed. Hence the need for new material and material research emerged. Graphene 2D has emerged as the device material and hBN-2D has emerged as the ideal substrate material. For ongoing Digital Revoluton to sustain, we need Petab/s and Exob/s transmission links. Graphene technology has matured to the level where Functional Graphene IC on Wafer Scale can be implemented such as Frequency Multiplier, high frequency Graphene Analog Amplifiers and Quaternary Digital Modulation circuits. These functional Graphene IC can be fabricated at wafer scale because of the development of Imperfection Immune Paradigm called VLSI-compatible Metallic CNT Removal Technique (VMR). To harness the exotic properties of graphene nanomaterials in real life application at macro scale graphene based 3D monolith have been developed which could become the basis of future batteries and solar cells. THz graphene chips will herald the peta and exo-bit rate optical fiber communication which is the answer to large data work load of Internet. Graphene is emerging as an important thermo-electric material which is capable of converting temperature difference into electric current.

中文翻译：

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石墨烯的广泛应用可行性报告

在2005年，迄今为止提供IC芯片性能增强功能的Dennard Scaling彻底崩溃了。因此，出现了对新材料和材料研究的需求。石墨烯2D已成为器件材料，hBN-2D已成为理想的衬底材料。为了持续进行数字革命，我们需要Petab / s和Exob / s传输链路。石墨烯技术已经成熟到可以实现晶圆级功能性石墨烯IC的水平，例如倍频器，高频石墨烯模拟放大器和四元数字调制电路。由于称为VLSI兼容金属CNT去除技术（VMR）的不完美免疫范例的发展，这些功能性石墨烯IC可以晶圆级制造。为了利用石墨烯纳米材料在现实生活中在宏观应用中的奇异特性，已经开发出了基于石墨烯的3D整料，这可能成为未来电池和太阳能电池的基础。THz石墨烯芯片将预示着Peta和exo位速率的光纤通信，这是对Internet的大数据工作量的解答。石墨烯正在作为一种重要的热电材料出现，该材料能够将温差转换为电流。