We are interested in the influence of spare part service measures on the performance of the front-end wafer fabrication process. This process is characterized by re-entrant flows due to the multiple layers present on chips. This exacerbates the effects of flow variability. We focus on the bottleneck resource. We consider three different service measures. The traditional aggregate fill rate and downtime waiting for parts do not take into account the number of outliers in the case of stock out. The third service measure is the number of extreme long downs, specifically designed at limiting outliers. We develop an improved method, combining optimization and simulation, to compare the performance of a front-end wafer fabrication process under these three service measures. In the studied case, the extreme long down service measure delivers superior performance and transparency. Our approach can help practitioners to choose the appropriate spare parts service measure, increasing fab performance.

中文翻译：

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前端晶圆厂选择哪些备件服务措施？

我们感兴趣的是备件服务措施对前端晶圆制造工艺性能的影响。由于芯片上存在多层，该过程的特点是可重入流。这加剧了流量可变性的影响。我们专注于瓶颈资源。我们考虑三种不同的服务措施。传统的总体填充率和等待零件的停机时间没有考虑缺货情况下的异常值数量。第三个服务指标是极长停机次数，专门用于限制异常值。我们开发了一种结合优化和模拟的改进方法，以比较这三种服务措施下前端晶圆制造工艺的性能。在所研究的案例中，超长羽绒服措施可提供卓越的性能和透明度。我们的方法可以帮助从业者选择合适的备件服务措施，提高晶圆厂的性能。