Abstract Process parameters that are addressed in literature to affect lapping process includes, abrasive grain size, types of abrasive, concentration of abrasives, viscosity of the compound, lapping pressure, lapping speed, lapping time, and lap material/disc material. However, a trajectory analysis of a single fixed abrasive particle shows various paths for different rotational speed ratio between lapping plate and work piece. Therefore, the objective of this paper is to investigate the effect of rotational speed ratio on conventional loose abrasive lapping process. In the study, kinematic trajectories of single fixed abrasive particle were presented for different rotational speed ratios between lapping plate and work piece. Then, experimental study was conducted on sliced silicon wafer samples under different rotational speed ratios and the MRR and surface roughness of each sample was measured. The result reveals that rotational speed ratio between the lapping plate and work piece has an effect on favoring slurry transport between plate and work piece which affects the performance of material removal rate. The future focus of study would be to study optimal rotational speed ratio as one process parameter.

中文翻译：

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压板与工件转速比对研磨工艺的影响

摘要 文献中提到的影响研磨工艺的工艺参数包括磨料粒度、磨料类型、磨料浓度、化合物粘度、研磨压力、研磨速度、研磨时间和研磨材料/盘材料。然而，单个固定磨粒的轨迹分析显示了研磨板和工件之间不同转速比的各种路径。因此，本文的目的是研究转速比对常规松散磨料研磨工艺的影响。在研究中，针对不同的研磨盘和工件之间的转速比，呈现了单个固定磨粒的运动轨迹。然后，对不同转速比下的切片硅片样品进行了实验研究，并测量了每个样品的 MRR 和表面粗糙度。结果表明，研磨板与工件之间的转速比有利于板与工件之间的泥浆输送，从而影响材料去除率的性能。未来的研究重点将是研究最佳转速比作为一种工艺参数。