Abstract

The physical and technological characteristic features of the installation of dies onto a temporary foundation in the internal wiring technology are studied. The justified selection of the material for the fixation of silicon dies active side down onto a temporary foundation from various solutions of polyamic acids (PAAs) is performed. The experimental dependence of the adhesion strength of silicon dies on the lifetime of the solutions of PAAs is found. The possible defects formed upon the imidization of PAAs in the process of creation of highly integrated microassemblies, multidie modules, and electronic modules of the “system in package” level are shown.

中文翻译：

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内部接线技术中将模具安装到临时基础上的过程的物理和技术特征

摘要

研究了在内部布线技术中将模具安装到临时基础上的物理和技术特征。从各种聚酰胺酸（PAA）溶液中合理选择用于固定硅片的材料，将其活性面朝下固定在临时基础上。发现了硅芯片的粘合强度与PAA溶液寿命之间的实验关系。显示了在“系统级封装”级别的高度集成的微型组件，多芯片模块和电子模块的创建过程中，PAA酰亚胺化时可能形成的缺陷。