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Investigation into the Influence of Sodium Lignosulfonate, Anionic Surfactants, and Their Mixtures on the Copper Cementation Rate by Zinc
Russian Journal of Non-Ferrous Metals ( IF 0.6 ) Pub Date : 2020-10-21 , DOI: 10.3103/s1067821220050077
E. B. Kolmachikhina , A.V. Sviridov , K. D. Naumov

Abstract

This article is devoted to the influence of sodium lignosulfonate (SL), anionic surfactants (sodium dodecylsulfate (SDS), sodium dodecylbenzene sulfonate (SDBS)), and their mixtures on the copper cementation rate by zinc. The results demonstrated a copper cementation rate decreasing at LS and SDBS concentrations increasing. Excessive zinc consumption was also detected on copper-ion cementation due to LS and SDBS anion adsorption onto positively charged zinc cathodic areas and copper particles. This led to a decrease in the growth rate of nuclei of copper particles and energy consumption for the formation of new nucleation centers, as well as the creation of conditions for reducing the overvoltage of hydrogen evolution. At the same time, an increase in temperature led to zinc consumption decreasing in the presence of LS. The reagents under investigation could be ranked according to their degree of negative influence on copper cementation increasing in the following order: SDS < SDBS < LS. Testing LS and SDS mixtures showed their irregular influence on the copper cementation rate at different temperatures. In experiments with LS and SDBS mixtures, a linear decrease in the copper-ion cementation rate upon an increase in SDBS concentration and simultaneous zinc-consumption enhancement was fixed. Due to the negative influence of the investigated reagents, we offered a purification method from organic impurities through the use of multilayered alumosilicates modified by cationic surfactants. The results indicate the high effectiveness of removing organic impurities from solutions, which allowed us to increase the cementation rate in the presence of the LS and SDBS mixture by 50% while, at the same time, decreasing zinc consumption.



中文翻译:

木质素磺酸钠,阴离子表面活性剂及其混合物对锌对铜固结速率影响的研究

摘要

本文专门研究木质素磺酸钠(SL),阴离子表面活性剂(十二烷基硫酸钠(SDS),十二烷基苯磺酸钠(SDBS))及其混合物对锌对铜胶结速率的影响。结果表明,在LS和SDBS浓度增加时,铜的胶结速率降低。由于LS和SDBS阴离子吸附到带正电的锌阴极区域和铜颗粒上,铜离子胶结时还检测到过量的锌消耗。这导致铜颗粒核生长速率的下降和用于形成新核中心的能量消耗的减少,以及为减少氢放出的过电压创造了条件。同时,温度升高导致存在LS时锌消耗量减少。可以根据对铜胶结的负面影响程度,按以下顺序对所研究的试剂进行排序:SDS <SDBS <LS。LS和SDS混合物的测试表明,它们在不同温度下对铜的胶结速率有不规则的影响。在使用LS和SDBS混合物进行的实验中,固定了SDBS浓度和同时提高锌消耗量的情况下,铜离子胶结速率的线性下降是固定的。由于所研究试剂的负面影响,我们提供了通过使用阳离子表面活性剂改性的多层铝硅酸盐从有机杂质中提纯的方法。结果表明从溶液中去除有机杂质的高效性,

更新日期:2020-10-30
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