In this article, we propose a fast thermal modeling tool, 3DSim, using a Green’s-function-based approach. Green’s-function-based approaches have been shown to be faster than the traditional finite-difference-based techniques. Our proposed tool can model steady-state and transient thermal profiles for both 2-D and 3-D chips, which may contain multiple active layers and fluid-carrying microchannels for heat removal. The unique advantage of our tool is that it models leakage power analytically using a piecewise-linear leakage model, thereby eliminating the need to iterate multiple times through the leakage–temperature feedback loop. We use several algebraic techniques and transforms to compute the thermal profile analytically and thereby speedup the process of calculation. To the best of our knowledge, transform-based approaches have not been used before to model the temperature in 3-D chips with microchannels. Our approach provides a $150\times $ speedup over state-of-the-art thermal simulators, with an error limited to 5%.

中文翻译：

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一种用于 3-D 芯片的基于绿色函数的快速泄漏感知热模拟器

在本文中，我们提出了一种使用基于格林函数的方法的快速热建模工具 3DSim。基于格林函数的方法已被证明比传统的基于有限差分的技术更快。我们提出的工具可以模拟 2-D 和 3-D 芯片的稳态和瞬态热分布，这些芯片可能包含多个活性层和用于散热的载液微通道。我们工具的独特优势在于它使用分段线性泄漏模型对泄漏功率进行分析建模，从而无需通过泄漏-温度反馈回路进行多次迭代。我们使用几种代数技术和变换来分析计算热剖面，从而加快计算过程。据我们所知，之前还没有使用基于变换的方法来模拟具有微通道的 3-D 芯片中的温度。与最先进的热模拟器相比，我们的方法提供了 150 美元/倍的加速，误差限制在 5%。