In this paper, a dimensionless creep correction factor is proposed to simplify the calculation by using a fitting function of creep displacement combined with reduced modulus formula. Using experimental results of PA12 under different testing conditions during indentation, the creep‐corrected calculations of contact depth, reduced modulus, and hardness are studied. Results show that the elastic modulus without creep correction is significantly over‐estimated, while the creep‐corrected elastic modulus is a constant value (1.25 GPa) which does not change with the test variables. Conversely, the nanohardness extracted by the conventional approach is under‐estimated and the creep‐corrected contact hardness is not constant due to the time‐dependent deformation. The introduction of creep correction factor can significantly simplify the correction calculation process of material parameters.

中文翻译：

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显微压痕过程中粘弹性材料的弹性模量和硬度的蠕变校正

本文提出了一种无量纲的蠕变校正因子，通过结合蠕变位移的拟合函数和简化模量公式来简化计算。利用压痕过程中不同测试条件下PA12的实验结果，研究了接触深度，降低的模量和硬度的蠕变校正计算。结果表明，未经蠕变校正的弹性模量明显高估，而经蠕变校正的弹性模量为常数值（1.25 GPa），不会随测试变量而变化。相反，传统方法提取的纳米硬度被低估了，并且由于时间依赖性变形，蠕变校正后的接触硬度不是恒定的。