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Transient analysis of a piezoelectric-orthotropic laminate weakened by multiple embedded and interface cracks under impact loads
Engineering Failure Analysis ( IF 4 ) Pub Date : 2020-10-16 , DOI: 10.1016/j.engfailanal.2020.105016
M. Ayatollahi , A.G. Milan , P. Mirzania

The transient response of a piezoelectric layer bonded to an orthotropic layer under anti-plane mechanical and in-plane electrical impacts is investigated in this paper. The problem consist of two parts. In the first part, the analysis is based on the stress and electric displacement fields caused by electro-elastic dislocation in the piezoelectric layer, while the second part consist of the interfacial crack formulation by introducing the dislocation situated at the interface of two bonded layers. For both problems, the dislocation solution are obtained utilizing Fourier and Laplace transforms. These solutions lead naturally to singular integral equations for dislocation density functions in the both cases of embedded and interface cracks. The integral equations are solved numerically to obtain dislocation density functions on the surface of crack, which are used to calculate dynamic field intensity factors.



中文翻译:

冲击载荷作用下被多个嵌入裂纹和界面裂纹削弱的压电正交各向异性层压板的瞬态分析

本文研究了在抗平面机械和平面内电冲击下粘结到正交各向异性层上的压电层的瞬态响应。该问题包括两个部分。在第一部分中,分析是基于压电层中电弹性位错所引起的应力和电位移场,而第二部分是通过引入位于两个粘结层界面处的位错来形成界面裂纹。对于这两个问题,都可以使用傅立叶和拉普拉斯变换获得位错解。这些解决方案自然导致在嵌入和界面裂纹的情况下,位错密度函数的奇异积分方程。

更新日期:2020-10-17
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