High temperature electromagnetic shielding materials that can eliminate electromagnetic interference (EMI) and withstand high temperature have vast potential in cutting-edge applications like aircraft, and here electromagnetic shielding shape memory polyimide (EMSMPI) is reported for the first time. EMSMPI is synthesized by incorporating 5 % short carbon fiber and 4 % carbon black into shape memory polyimide matrix, its glass transition temperature of 308 °C is higher than other electromagnetic shielding polymers, and it can hang the kettle 43,000 times heavier than itself. The 0.35 mm thick EMSMPI film exhibits nice shielding effects with average EMI shielding effectiveness of 23.9 dB in X-band, and its shielding mechanism is discussed. Shape processability of EMSMPI endowed by shape memory effect is valuable for sophisticated devices as it can be processed into different shapes conveniently, and shielding effectiveness after thirty cycles is still higher than the recommended limit of 20 dB for commercial applications.

可以消除电磁干扰（EMI）和承受高温的高温电磁屏蔽材料在飞机等尖端应用中具有巨大的潜力，这里首次报道了电磁屏蔽形状记忆聚酰亚胺（EMSMPI）。EMSMPI是通过将5％的短碳纤维和4％的炭黑掺入形状记忆聚酰亚胺基体中而合成的，其玻璃化转变温度为308°C，高于其他电磁屏蔽聚合物，并且可比其自身悬挂43,000倍。0.35 mm厚的EMSMPI膜在X波段具有良好的屏蔽效果，平均EMI屏蔽效果为23.9 dB，并讨论了其屏蔽机理。