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W and TiO2 particles synergistic strengthened Cu matrix nanocomposites by mechano-chemical method
Powder Metallurgy ( IF 1.4 ) Pub Date : 2020-10-14 , DOI: 10.1080/00325899.2020.1833139
Tianxing Lu 1 , Cunguang Chen 1, 2 , Pei Li 1 , Chenzeng Zhang 1 , Weihao Han 1 , Fang Yang 1 , Zhimeng Guo 1, 2
Affiliation  

ABSTRACT In this study, a novel W and TiO2 synergistic strengthened copper matrix nanocomposite was prepared by a powder metallurgy route with a mechano-chemical method and subsequent consolidation. Nano-sized W and TiO2 particles in the composite powder were fabricated by solid-phase reaction during the mechanical alloying procedure. The average sizes of W and TiO2 particles were only 51 and 171 nm, far finer than single-phase particle-strengthened composites. It was found that the nanoparticles effectively resisted the grain coarsening in the copper matrix, containing the grains with an average size of 350 nm. The ultimate tensile strength and electrical conductivity of the copper composite are 520 MPa and 74 IACS%, achieve an ideal trade-off between them. The observations suggested that the nanoparticles were highly uniformly dispersed in the copper matrix, and the particle coarsening was restrained as the results of the interaction effects between W and TiO2 nanoparticles.

中文翻译:

W和TiO2颗粒协同强化Cu基纳米复合材料的机械化学方法

摘要 在这项研究中,通过粉末冶金路线、机械化学方法和随后的固结制备了一种新型的 W 和 TiO2 协同强化铜基纳米复合材料。在机械合金化过程中通过固相反应制备复合粉末中的纳米尺寸的 W 和 TiO2 颗粒。W 和 TiO2 颗粒的平均尺寸仅为 51 和 171 nm,远小于单相颗粒强化复合材料。发现纳米颗粒有效地阻止了铜基体中的晶粒粗化,其中包含平均尺寸为 350 nm 的晶粒。铜复合材料的极限拉伸强度和电导率分别为 520 MPa 和 74 IACS%,在两者之间实现了理想的折衷。
更新日期:2020-10-14
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