The Printed Electronics (PE) is expected to revolutionise the way electronics will be manufactured in the future. Building on the achievements of the traditional printing industry, and the recent advances in flexible electronics and digital technologies, PE may even substitute the conventional silicon-based electronics if the performance of printed devices and circuits can be at par with silicon-based devices. In this regard, the inorganic semiconducting materials-based approaches have opened new avenues as printed nano (e.g. nanowires (NWs), nanoribbons (NRs) etc.), micro (e.g. microwires (MWs)) and chip (e.g. ultra-thin chips (UTCs)) scale structures from these materials have been shown to have performances at par with silicon-based electronics. This paper reviews the developments related to inorganic semiconducting materials based high-performance large area PE, particularly using the two routes i.e. Contact Printing (CP) and Transfer Printing (TP). The detailed survey of these technologies for large area PE onto various unconventional substrates (e.g. plastic, paper etc.) is presented along with some examples of electronic devices and circuit developed with printed NWs, NRs and UTCs. Finally, we discuss the opportunities offered by PE, and the technical challenges and viable solutions for the integration of inorganic functional materials into large areas, 3D layouts for high throughput, and industrial-scale manufacturing using printing technologies.

中文翻译：

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基于无机半导体纳米芯片级结构的高性能印刷电子产品

印刷电子（PE）有望彻底改变未来电子产品的制造方式。基于传统印刷行业的成就以及柔性电子和数字技术的最新进展，如果印刷器件和电路的性能能够与硅基器件相媲美，PE甚至可能取代传统的硅基电子器件。在这方面，基于无机半导体材料的方法开辟了新的途径，如印刷纳米（例如纳米线（NW）、纳米带（NR）等）、微米（例如微米线（MW））和芯片（例如超薄芯片）这些材料制成的 UTC)) 尺度结构已被证明具有与硅基电子产品相当的性能。本文综述了基于无机半导体材料的高性能大面积PE的相关进展，特别是接触印刷（CP）和转移印刷（TP）这两种路线。详细介绍了在各种非常规基材（例如塑料、纸张等）上进行大面积 PE 技术的详细调查，以及使用印刷 NW、NR 和 UTC 开发的电子设备和电路的一些示例。最后，我们讨论了 PE 提供的机遇，以及将无机功能材料集成到大面积、高吞吐量的 3D 布局以及使用打印技术的工业规模制造的技术挑战和可行的解决方案。