In this study, a silver (Ag) coated copper (Cu) core–shell microparticles paste were fabricated and screen-printed on Polyimide (PI) substrates. It was sintered via intense pulsed light (IPL) sintering technique. IPL irradiation condition (i.e. pulse duration, irradiation energy) was optimized to obtain high conductivity and good oxidation resistance characteristics. To increase the packing density of the pastes and its oxidation resistance, Ag nanoparticles (Ag NPs) were added to Cu/Ag core–shell microparticles (core–shell MPs) paste with optimal mass ratio. To analyze the sintering and oxidation characteristics of hybrid pastes (Ag NPs + core–shell MPs), a scanning electron microscope (SEM) and a focused ion beam (FIB) was used. To demonstrate the mechanism of the sintering process on hybrid pastes, heat generation at the junctions between particles were simulated using Multiphysics COMSOL program. The packing density of the hybrid pastes was investigated using CATIA digital mock-up (DMU) program. In addition, to confirm the heat generation with respect to the packing density of the hybrid pastes, in-situ temperature monitoring process was conducted. As a result, hybrid paste pattern sintered with IPL showed excellent oxidation resistance (resistance increase rate in 300 °C for 5 h: 4.92%), and high electrical conductivity (6.54 μΩ cm).

Graphic abstract

中文翻译：

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铜/银核壳微粒与银纳米微粒混合浆料的研究及其强脉冲光烧结特性以提高抗氧化性

在这项研究中，制造了一种涂有银（Ag）的铜（Cu）核-壳微粒糊剂，并将其丝网印刷在聚酰亚胺（PI）基底上。它是通过强脉冲光（IPL）烧结技术进行烧结的。优化IPL辐照条件（即脉冲持续时间，辐照能量）以获得高电导率和良好的抗氧化特性。为了提高糊剂的堆积密度及其抗氧化性，将银纳米颗粒（Ag NPs）添加到具有最佳质量比的Cu / Ag核-壳微粒（core-shell MPs）糊剂中。为了分析混合浆料（Ag NPs +核壳MPs）的烧结和氧化特性，使用了扫描电子显微镜（SEM）和聚焦离子束（FIB）。为了说明混合浆料上烧结过程的机理，使用Multiphysics COMSOL程序模拟了粒子之间交界处的热量生成。使用CATIA数字模型（DMU）程序研究了混合浆料的堆积密度。另外，为了确认相对于混合糊料的堆积密度的发热，进行了原位温度监测过程。结果，用IPL烧结的混合浆料图案显示出优异的抗氧化性（在300℃下5小时的电阻增加率：4.92％）和高电导率（6.54μΩcm）。

图形摘要