Purpose

This paper aims to discuss the key factors affecting the quality characteristics, such as the number of solder balls, the spread distance of residual underfill and the completion time of the underfilling.

Design/methodology/approach

The Taguchi method is applied to configure the orthogonal table and schedule and execute the experiment. In addition, principal components analysis is used to obtain the points. Then, based on gray relational analysis and the technique for order preference by similarity to ideal solution, the closeness between each quality characteristic and the ideal solution is adopted as the basis for evaluating the quality characteristics.

Findings

The optimal parameter combination is proposed, which includes 4 dispensing (11 mg/dispensing), a “half flow” interval state, 80°C preheating module PCB board and an L-shaped dispensing path and verification testing is performed.

Originality/value

For vehicles and handheld electronic products, solder joints that connect electronic components to printed circuit boards may be cracked due to collision, vibration or falling. Consequently, solder balls are closely surrounded and protected by the underfill to improve joint strength and resist external force factors, such as collision and vibration. This paper addresses the defects caused during the second reflow process of a vehicle electronic communication module after the underfilling process.

中文翻译：

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多质量参数设计在底部填充工艺优化中的应用-以汽车电子模块为例

目的

本文旨在探讨影响质量特性的关键因素，例如焊球的数量，残留的底部填充剂的扩散距离以及底部填充剂的完成时间。

设计/方法/方法

Taguchi方法用于配置正交表并安排和执行实验。另外，使用主成分分析来获得分数。然后，基于灰色关联分析和基于与理想解的相似度的订单偏好技术，采用每个质量特征与理想解之间的接近度作为评估质量特征的基础。

发现

建议的最佳参数组合包括4个分配点（11 mg /个分配点），“半流量”间隔状态，80°C预热模块PCB板和L形分配点路径，并进行验证测试。

创意/价值

对于车辆和手持式电子产品，将电子部件连接到印刷电路板的焊点可能会因碰撞，振动或掉落而破裂。因此，焊球被底部填充物紧密围绕并保护着，以提高接头强度并抵抗外力因素，例如碰撞和振动。本文解决了在底部填充过程之后，在车辆电子通信模块的第二次回流过程中造成的缺陷。