In this paper, we propose a thermal wind speed sensor Verilog-A model with thermal-fluid-electric hybrid characteristics. Because the structure of the thermal wind sensor and the interface circuit chip are designed separately, which cannot effectively carry out MEMS-IC (integrated circuit) co-simulation, the overall performance of the sensor and interface circuit chip is prone to large deviation. At the same time, the separation of MEMS structure and IC design process leads to long product development cycle and high cost. This paper proposes an improved simulation model by analyzing the behavior characteristics of the thermal wind speed sensor. The simulation model consists of 11 thermistors, 3 capacitors, a voltage-controlled voltage source, and a voltage-controlled current source. The Taylor series expansion of the differential equation of heat conduction is carried out, and then the thermistor and capacitor networks are established according to the corresponding relationship ...

中文翻译：

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CMOS-MEMS热风速传感器的有效宏模型

在本文中，我们提出了一种具有热流体电混合特性的热风速传感器Verilog-A模型。由于热风传感器和接口电路芯片的结构分别设计，不能有效地进行MEMS-IC（集成电路）的协同仿真，因此传感器和接口电路芯片的整体性能容易出现较大偏差。同时，MEMS结构和IC设计过程的分离导致较长的产品开发周期和较高的成本。通过分析热风速传感器的行为特征，提出了一种改进的仿真模型。仿真模型由11个热敏电阻，3个电容器，一个压控电压源和一个压控电流源组成。