Thermal and dielectric properties of epoxy-based composites filled with flake and whisker type hexagonal boron nitride materials,High Performance Polymers

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Thermal and dielectric properties of epoxy-based composites filled with flake and whisker type hexagonal boron nitride materials
High Performance Polymers ( IF 1.8 ) Pub Date : 2020-10-07 , DOI: 10.1177/0954008320959413
Rongkun Yang _{1,

2} , Mingming Sheng _{1,

2} , Yujun Zhang _{1,

2,

3} , Hongyu Gong _{1,

2} , Xiao Lin _{1,

2} , Yaran Pei _{1,

2} , Xinfeng Zhang _{1,

2}

Affiliation

In this work, the epoxy-based composites filled with 3-Aminopropyltriethoxysilane (KH-550) modified binary filler of hexagonal boron nitride (h-BN) flakes and h-BN whiskers were fabricated, and the...

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