Abstract

With the aim of understanding failure modes in the peeling of silicone-based adhesive joints and, in particular, the occurrence of adhesive or cohesive failure, an experimental campaign has been conducted by considering plastic substrates with different surface roughness. A flexible strip has been bonded onto such substrates using a silicone adhesive, by controlling its thickness. Peeling tests with 90° and 180° peeling angle configurations have been performed and the effect of joint parameters, such as surface roughness and adhesive thickness, onto the adhesion energy and the failure mode are herein discussed in detail. Experimental results show that the failure mode varies in each peeling test configuration such that in the case of 180° peeling test there is mainly cohesive failure, while for 90° peeling angle, a combination of adhesive and cohesive failure occurs. Moreover, due to the presence of different failure modes in each peeling configuration, the substrate roughness can increase the adhesion energy only in 90° peeling tests.

摘要

为了了解有机硅粘合剂接头剥离中的失效模式，特别是粘合剂或内聚失效的发生，已经通过考虑具有不同表面粗糙度的塑料基材进行了一项实验活动。通过控制其厚度，已使用有机硅粘合剂将柔性条粘合到此类基材上。已经进行了具有 90° 和 180° 剥离角配置的剥离测试，并且本文详细讨论了诸如表面粗糙度和粘合剂厚度等接头参数对粘合能量和失效模式的影响。实验结果表明，在每种剥离试验配置中，失效模式各不相同，在 180°剥离试验的情况下，主要是内聚破坏，而对于 90°剥离角度，发生粘合和内聚破坏的组合。此外，由于每种剥离配置中存在不同的失效模式，基板粗糙度只能在 90°剥离测试中增加粘附能。