Modern technologies and devices ranging from smartphones, computers, cloud computing, industrial automation, automobiles, to the Internet of Things are enabled by integrated circuits (ICs) and their associated packages. The ICs have evolved from the early small-scale integration (SSI) to the later more complex very-large-scale integration (VLSI) and the subsequent ultra-large-scale integration (ULSI), in a continuous quest for improved functionality, higher performance, smaller form factors, and lower cost. The rate has generally followed Moore’s law.

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前言：“高级微电子封装的可靠性第二部分：结构与性能的关系”特别节

从智能手机，计算机，云计算，工业自动化，汽车到物联网的现代技术和设备都通过集成电路（IC）及其关联的包装实现。这些IC已从早期的小规模集成（SSI）发展到后来的更复杂的超大规模集成（VLSI），以及随后的超大规模集成（ULSI），以不断寻求更高的功能性。性能，更小的外形尺寸和更低的成本。汇率通常遵循摩尔定律。