In this letter, we propose a novel signaling figure of merit (s-FoM) for comparison of signaling schemes across different packaging technologies. It considers all the essential metrics that affect system performance and efficiency and combines them in a simple, easily quantifiable manner. These include energy per bit, data-bandwidth per unit shoreline, latency, length of the link, and real-estate overhead. This tool captures all the performance trade-offs and enables a fair comparison across different packaging platforms and integration schemes.

中文翻译：

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先进封装的信号品质因数 (s-FoM)


在这封信中，我们提出了一种新颖的信号品质因数（s-FoM），用于比较不同封装技术的信号方案。它考虑了影响系统性能和效率的所有基本指标，并以简单、易于量化的方式将它们组合起来。其中包括每比特能量、每单位海岸线的数据带宽、延迟、链路长度和不动产开销。该工具捕获了所有性能权衡，并能够在不同的封装平台和集成方案之间进行公平的比较。