Digital light processing (DLP), a subclass of vat photopolymerization, is one of the most efficient additive manufacturing (AM) techniques that can be used to print complex objects with high precision at a greater speed than those of the other AM processes. However, printed objects are typically brittle because networks of cured resins are highly crosslinked, thereby limiting their range of possible applications. Currently, only a few commercial photocurable elastomers used for DLP can produce materials with moderate tensile strain, poor strength, and low modulus. Herein, we present a simple method for preparing photocurable resins that not only exhibit a low viscosity at room temperature, but also demonstrate tunable elasticity and strength. These novel resins are prepared from commercially available acrylate-based oligomers and monomers, which are appropriately selected to achieve a variety of mechanical properties. Subsequenlty, key parameters are investigated, including the viscosity of the uncured resin, critical energy at which the resin begins to solidify (E_c), depth of penetration of the curing light (D_p), and degree of curing. The viscosities of the developed resins range between 0.85 and 3.10 Pa s, and their curing and mechanical properties can be adjusted by varying the oligomer-to-monomer weight ratio. The E_c (6.9–9.2 mJ cm⁻²) and D_p (192–271 μm) of all the uncured resins are obtained from the working curves. The developed photoelastomers exhibit a wide range of tensile properties (tensile strain of 110–365%, tensile strength of 0.8–10 MPa, and modulus of 0.5–10 MPa), thereby facilitating their use in various applications.

数字光处理（DLP）是桶型光聚合的一个子类，是最有效的增材制造（AM）技术之一，可用于以比其他AM加工更快的速度高精度打印复杂对象。但是，由于固化树脂的网络高度交联，印刷物通常很脆，从而限制了其可能的应用范围。当前，仅用于DLP的几种商业用光固化弹性体可以生产具有中等拉伸应变，强度差和模量低的材料。本文中，我们提出了一种制备光固化树脂的简单方法，该树脂不仅在室温下表现出低粘度，而且还具有可调节的弹性和强度。这些新型树脂由市售的丙烯酸酯基低聚物和单体制备而成，其适当选择来实现各种机械性能。随后研究了关键参数，包括未固化树脂的粘度，树脂开始固化的临界能量（E _c），固化光的渗透深度（D _p）和固化程度。显影树脂的粘度范围为0.85至3.10 Pa s，可以通过改变低聚物与单体的重量比来调节其固化和机械性能。从工作曲线中获得所有未固化树脂的E _c（6.9–9.2 mJ cm ^-2）和D _p（192–271μm）。发达的光弹性体具有广泛的拉伸性能（110-365％的拉伸应变，0.8-10 MPa的拉伸强度和0.5-10 MPa的模量），从而促进了它们在各种应用中的使用。