Nanoindentation process is performed by molecular dynamics simulations to study the plastic deformation phenomena and mechanical properties of the amorphous/nanocrystalline Cu_xTa_100-x/Cu nanolaminates. The influences of the number of Cu layers, indenter velocity, temperature, and percentage of the Cu–Ta component are systematically assessed. By introducing the Cu nanocrystalline layer and controlling its thickness, the shear bands propagation and the expansion of plastic deformation are restricted. Further, the important factors of mechanical property such as indentation force, hardness, recovery ratio, von Mises stress are significantly affected by adding Cu nanocrystalline layers and changing the working conditions. Based on simulation results, dominant deformation mechanisms and phenomena of the amorphous/nanocrystalline Cu_xTa_100-x/Cu nanolaminates are propounded and deeply discussed.

通过分子动力学模拟执行纳米压痕工艺，以研究非晶/纳米晶Cu _x Ta _100-x的塑性变形现象和力学性能/ Cu纳米层压板。系统地评估了铜层数，压头速度，温度和铜-钽组分百分比的影响。通过引入铜纳米晶层并控制其厚度，限制了剪切带的传播和塑性变形的扩展。此外，机械性能的重要因素，如压入力，硬度，恢复率，冯·米塞斯应力，会因添加铜纳米晶层和改变工作条件而受到显着影响。基于模拟结果，提出并深入讨论了非晶/纳米晶Cu _x Ta _100-x / Cu纳米层合物的主要变形机理和现象。