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W-band system-on-chip electron cyclotron emission imaging system on DIII-D
Review of Scientific Instruments ( IF 1.3 ) Pub Date : 2020-09-01 , DOI: 10.1063/5.0018082
Y. Zhu 1 , J.-H. Yu 1 , G. Yu 1 , Y. Ye 1 , B. Tobias 2 , A. Diallo 3 , G. Kramer 3 , Y. Ren 3 , C. W. Domier 1 , X. Li 4 , C. Luo 1 , M. Chen 1 , Y. Chen 1 , N. C. Luhmann 1
Affiliation  

Monolithic, millimeter-wave "system-on-chip" (SoC) technology has been employed in heterodyne receiver integrated circuit radiometers in a newly developed Electron Cyclotron Emission Imaging (ECEI) system on the DIII-D tokamak for 2D electron temperature profile and fluctuation evolution diagnostics. A prototype module operating in the E-band (72 GHz-80 GHz) was first employed in a 2 × 10 element array that demonstrated significant improvements over the previous quasi-optical Schottky diode mixer arrays during the 2018 operational campaign of the DIII-D tokamak. For compatibility with International Thermonuclear Experimental Reactor relevant scenarios on DIII-D, the SoC ECEI system was upgraded with 20 horn-waveguide receiver modules. Each individual module contains a University of California Davis designed W-band (75 GHz-110 GHz) receiver die that integrates a broadband low noise amplifier, a double balanced down-converting mixer, and a ×4 multiplier on the local oscillator (LO) chain. A ×2 multiplier and two IF amplifiers are packaged and selected to further boost the signal strength and downconvert the signal frequency. The upgraded W-band array exhibits >30 dB additional gain and 20× improvement in noise temperature compared with the previous Schottky diode radio frequency mixer input systems; an internal 8 times multiplier chain is used to bring down the LO frequency below 12 GHz, thereby obviating the need for a large aperture for quasi-optical LO coupling and replacing it with coaxial connectors. Horn-waveguide shielding housing avoids out-of-band noise interference on each individual module. The upgraded ECEI system plays an important role for absolute electron temperature evolution and fluctuation measurements for edge and core region transport physics studies.

中文翻译:

DIII-D上的W波段片上系统电子回旋发射成像系统

在 DIII-D 托卡马克上新开发的电子回旋发射成像 (ECEI) 系统中,外差接收器集成电路辐射计采用了单片毫米波“片上系统”(SoC) 技术,用于二维电子温度分布和波动进化诊断。在 E 波段 (72 GHz-80 GHz) 中运行的原型模块首次用于 2 × 10 元件阵列,在 DIII-D 的 2018 年运行活动期间,该阵列与之前的准光学肖特基二极管混频器阵列相比有了显着改进托卡马克。为了与 DIII-D 上的国际热核实验反应堆相关场景兼容,SoC ECEI 系统升级了 20 个喇叭波导接收器模块。每个单独的模块都包含一个由加州大学戴维斯分校设计的 W 波段 (75 GHz-110 GHz) 接收器芯片,该芯片集成了宽带低噪声放大器、双平衡下变频混频器和本地振荡器 (LO) 上的 ×4 乘法器链。一个×2乘法器和两个中频放大器被封装和选择,以进一步增强信号强度和下变频信号频率。与之前的肖特基二极管射频混频器输入系统相比,升级后的 W 波段阵列具有 >30 dB 的额外增益和 20 倍的噪声温度改善;内部 8 倍乘法器链用于将 LO 频率降低到 12 GHz 以下,从而无需大孔径用于准光 LO 耦合并用同轴连接器取而代之。喇叭波导屏蔽外壳避免了每个单独模块上的带外噪声干扰。升级后的 ECEI 系统在边缘和核心区域传输物理研究的绝对电子温度演化和波动测量方面发挥着重要作用。
更新日期:2020-09-01
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