Soldering & Surface Mount Technology ( IF 1.7 ) Pub Date : 2020-09-21 , DOI: 10.1108/ssmt-12-2019-0043 Rui Xi , Jiangyou Yu , Le Cao , Xiaojiang Zheng , Jun Guo
Purpose
Most solder paste printers are configured to periodically clean the stencil to maintain printing quality. However, a periodical cleaning control may result in excessive cleaning operations. The purpose of this paper is to develop a control method to schedule stencil cleaning operations appropriately.
Design/methodology/approach
A hybrid failure rate model of the stencil printing process with age reduction factor and failure rate increase factor is presented. A stencil cleaning policy based on system reliability is introduced. An optimization model used to derive the optimal stencil cleaning schedule is provided.
Findings
An aperiodic stencil cleaning control with good adaptability is achieved. A comparative analysis indicates that aperiodic control has better printing system reliability than traditional periodical control under the same cleaning resource consumption.
Originality/value
Periodical cleaning control commonly used in industrial printing process often results in excessive cleaning operations. By incorporating the printing system reliability, this paper develops an aperiodic stencil cleaning control method based on hybrid failure rate model of the stencil printing process. It helps to reduce unnecessary cleaning operations while keeping printing quality stable.
中文翻译:
模版印刷的清洁控制会降低性能
目的
大多数焊膏印刷机都配置为定期清洁模板以保持印刷质量。但是,定期清洁控制可能会导致过度的清洁操作。本文的目的是开发一种控制方法,以适当安排模板清洗操作的时间。
设计/方法/方法
提出了一种模板印刷工艺的混合失效率模型,该模型具有寿命降低因子和失效率增加因子。介绍了基于系统可靠性的模板清洗策略。提供了用于得出最佳模板清洗时间表的优化模型。
发现
实现了具有良好适应性的非周期性模版清洁控制。对比分析表明,在相同的清洁资源消耗下,非周期性控制比传统的定期控制具有更好的打印系统可靠性。
创意/价值
通常在工业印刷过程中使用的定期清洁控制通常会导致过度的清洁操作。通过结合印刷系统的可靠性,本文开发了一种基于模版印刷过程混合故障率模型的非周期性模版清洗控制方法。它有助于减少不必要的清洁操作,同时保持打印质量稳定。