In this study, the effect of viscosity on ceria abrasive removal during the buff clean process was investigated. First, a numerical simulation was performed to observe the shear stress on the wafer. The shear stress increased as the viscosity increased. These results imply that the viscosity increases the drag force acting on the abrasives, which can improve abrasive removal. Based on the results of the numerical simulation, the ceria abrasive removal was measured using inductively coupled plasma mass spectroscopy (ICP-MS). The ICP-MS results showed that the increased viscosity improved the cleaning efficiency of the ceria abrasive removal by 70%. In addition, a lowering of the water temperature also resulted in an increase in abrasive removal as the viscosity increased. These results can be used to improve ceria abrasive removal during the buff clean process.

中文翻译：

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抛光过程中粘度对二氧化铈磨料去除的影响

在这项研究中，研究了粘度对抛光抛光过程中二氧化铈磨料去除的影响。首先，进行数值模拟以观察晶片上的剪切应力。剪切应力随着粘度的增加而增加。这些结果暗示粘度增加了作用在磨料上的阻力，这可以改善磨料的去除。基于数值模拟的结果，使用电感耦合等离子体质谱法（ICP-MS）测量了氧化铈磨料的去除。ICP-MS结果表明，粘度的提高使二氧化铈磨料去除的清洁效率提高了70％。另外，随着粘度的增加，水温的降低也导致磨料去除量的增加。