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Solvent-free encapsulation of curing agents for high performing one-component epoxy adhesives
Composites Part B: Engineering ( IF 12.7 ) Pub Date : 2020-09-28 , DOI: 10.1016/j.compositesb.2020.108438
Sung Min Jee , Cheol-Hee Ahn , Jong Hyuk Park , Tae Ann Kim , Min Park

One-component epoxy adhesives, in which the epoxy resin and curing agent are premixed, have many commercial advantages including reduced working time and stable performance. However, these adhesives suffer from a short shelf life even at room temperature. Here, core-shell structured curing agents were prepared via a dry particle coating (DPC) process that improved the storage stability of one-component epoxy adhesives. The DPC process is a simple, economic, and solvent-free method to fabricate core-shell structured materials using mechanical forces. Graphene nanoplatelets (GNPs) were used as encapsulating materials due to their high thermal conductivity and large surface areas. With the GNP-encapsulated curing agents, a one-component epoxy adhesive displayed significantly enhanced storage stability while maintaining its fast curing behavior. In particular, the pot life of the adhesive increased to 60 days, which is over two-times longer than that of a pristine epoxy adhesive. The curing temperature increased by up to 5.6 °C, which is a smaller increase than that observed when non-thermally conductive materials were used for encapsulation. Furthermore, the GNPs provided reinforcement in the cured epoxy adhesive, thereby improving the lap shear strength by 20–30%.



中文翻译:

高性能单组分环氧胶粘剂的无溶剂封装固化剂

预混合了环氧树脂和固化剂的单组分环氧粘合剂具有许多商业优势,包括减少工作时间和稳定的性能。但是,这些粘合剂即使在室温下也具有短的保存期限。在这里,核壳结构的固化剂是通过干颗粒涂层(DPC)工艺制备的,该工艺改善了单组分环氧粘合剂的储存稳定性。DPC工艺是一种使用机械力制造核壳结构材料的简单,经济,无溶剂的方法。石墨烯纳米片(GNP)由于其高导热性和大表面积而被用作封装材料。使用GNP封装的固化剂,单组分环氧胶粘剂在保持其快速固化性能的同时,显着提高了储存稳定性。特别是,胶粘剂的适用期增加到60天,是原始环氧胶粘剂使用寿命的两倍以上。固化温度最高可提高5.6°C,这比使用非导热材料进行封装时所观察到的温度要小。此外,GNP在固化的环氧胶粘剂中提供了增强作用,从而使搭接剪切强度提高了20–30%。

更新日期:2020-10-04
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