This paper describes an experimental study of the cooling capabilities of microchannel and micro-pin-fin based on-chip cooling systems. The on-chip cooling systems integrated with a micro heat sink, simulated power IC (integrated circuit) and temperature sensors are fabricated by micromachining and silicon-to-silicon direct bonding. Three micro heat sink structures: a microchannel heat sink (MCHS), an inline micro-pin-fin heat sink (I-MPFHS) and a staggered micro-pin-fin heat sink (S-MPFHS) are tested in the Reynolds number range of 79.2 to 882.3. The results show that S-MPFHS is preferred if the water pump can provide enough pressure drop. However, S-MPFHS has the worst performance when the rated pressure drop of the pump is lower than 1.5 kPa because the endwall effect under a low Reynolds number suppresses the disturbance generated by the staggered micro pin fins but S-MPFHS is still preferred when the rated pressure drop of the pump is in the range of 1.5 to 20 kPa. When the rated pressure drop of the pump is higher than 20 kPa, I-MPFHS will be the best choice because of high heat transfer enhancement and low pressure drop price brought by the unsteady vortex street.

中文翻译：

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n硅-硅直接键合的基于微通道和微细鳍片的芯片冷却系统的实验研究

本文介绍了基于芯片的冷却系统的微通道和微针鳍冷却能力的实验研究。集成有微型散热器，模拟功率IC（集成电路）和温度传感器的片上冷却系统是通过微加工和硅对硅直接键合制造的。三种微型散热器结构：在雷诺数范围内测试了微通道散热器（MCHS），嵌入式微型引脚翅片散热器（I-MPFHS）和交错微型引脚翅片散热器（S-MPFHS） 79.2至882.3。结果表明，如果水泵能够提供足够的压降，则S-MPFHS是首选。但是，当泵的额定压降低于1时，S-MPFHS的性能最差。5 kPa是因为在低雷诺数下的端壁效应会抑制由交错的微针鳍产生的干扰，但是当泵的额定压降在1.5至20 kPa范围内时，S-MPFHS仍然是首选。当泵的额定压降高于20 kPa时，I-MPFHS将是最佳选择，因为不稳定的涡街带来了更高的传热效率和更低的压降价格。