Abstract Nowadays, the Riv(et)-Bonding technique has become a major joining approach in the automotive industry. It effectively incorporates the benefits of the adhesive bonding and the self-pierce riveting (SPR), but overcomes their individual drawbacks. Finite element (FE) simulation of the SPR process now plays a very important role during the product design and manufacture processes in the automotive field. However, there is no reported progress in the simulation of the Riv-Bonding process. To deepen understandings of this joining method, a FE model of the Riv-Bonding process suitable for industrial applications was developed in this study. The Ostwald-de Waele power law was adopted to approximately represent properties of the adhesive SikaPower 498. Interrupted laboratory tests of the SPR process and the Riv-Bonding process were carried out to calibrate the FE model, and another eight types of joints were experimentally made to verify the effectiveness of the developed model. Meanwhile, the effects of the adhesive layer on the joint quality and the riveting process were analysed by comparing the interrupted test results of the two processes. The adhesive distribution during the Riv-Bonding process was also discussed. The developed model was proven capable of predicting the Riv-Bonding process, including the adhesive distribution, the solid parts deformation and the load-displacement curve. Unlike the SPR simulation, the blank-holder strike during the clamping stage should be properly modelled in the simulation model of the Riv-Bonding process, due to its noticeable influences on the adhesive distribution as well as on the top sheet deformation. It was also found that, under the studied joint configuration, the adhesive layer demonstrated slightly negative effects on the riveted connection of the Riv-Bonded joints. The simulation model developed in this study lays a foundation for further quality prediction and mechanical strengths modelling of the Riv-Bonded joints.

中文翻译：

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Riv-Bonding 过程的数值模拟和实验研究

摘要 如今，Riv(et)-Bonding 技术已成为汽车行业的主要连接方法。它有效地结合了粘合剂粘合和自冲铆接 (SPR) 的优点，但克服了它们各自的缺点。SPR 过程的有限元 (FE) 模拟现在在汽车领域的产品设计和制造过程中发挥着非常重要的作用。然而，在 Riv-Bonding 过程的模拟方面没有报告进展。为了加深对这种连接方法的理解，本研究开发了适用于工业应用的 Riv-Bonding 过程的有限元模型。采用 Ostwald-de Waele 幂律来近似表示粘合剂 SikaPower 498 的特性。对 SPR 过程和 Riv-Bonding 过程进行了间断的实验室测试以校准有限元模型，并通过实验制作了另外八种类型的接头以验证所开发模型的有效性。同时，通过比较两种工艺的间断试验结果，分析了胶层对接头质量和铆接工艺的影响。还讨论了 Riv-Bonding 过程中的粘合剂分布。开发的模型被证明能够预测 Riv-Bonding 过程，包括粘合剂分布、固体部件变形和载荷位移曲线。与 SPR 模拟不同，夹紧阶段的压边撞击应在 Riv-Bonding 过程的模拟模型中正确建模，由于其对粘合剂分布以及顶板变形的显着影响。还发现，在所研究的接头配置下，粘合剂层对 Riv-Bonded 接头的铆接连接表现出轻微的负面影响。本研究中开发的仿真模型为 Riv-Bonded 接头的进一步质量预测和机械强度建模奠定了基础。