当前位置：
X-MOL 学术
›
IEEE J. Solid-State Circuits
›
论文详情
Our official English website, www.x-mol.net, welcomes your
feedback! (Note: you will need to create a separate account there.)
Introduction to the Special Section on the 2019 Asian Solid-State Circuits Conference (A-SSCC)
IEEE Journal of Solid-State Circuits ( IF 4.6 ) Pub Date : 2020-09-24 , DOI: 10.1109/jssc.2020.3012639 Atsushi Kawasumi , Mototsugu Hamada , Po-Hung Chen
IEEE Journal of Solid-State Circuits ( IF 4.6 ) Pub Date : 2020-09-24 , DOI: 10.1109/jssc.2020.3012639 Atsushi Kawasumi , Mototsugu Hamada , Po-Hung Chen
This Issue of the IEEE Journal of Solid-State Circuits (JSSC) includes some of the highlights of the best papers from the 2019 Asian Solid-State Circuits Conference (A-SSCC), which was held at The Parisian Macao, Macao, China, on November 4–6, 2019. As one of the five conferences fully sponsored by the IEEE Solid-State Circuits Society, the A-SSCC was in its 15th appearance in 2019 since its inauguration in 2005 in Taiwan. Rotating among Asian countries, the A-SSCC is quickly becoming one of the leading global forums for the presentation of advances in solid-state circuits and system-on-a-chip (SOC). From 2018, this conference accepts field-programmable gate array (FPGA) papers for presentation and demo and allows two-page format papers for submission and publication.
更新日期：2020-09-25
京公网安备 11010802027423号