Nanoindentation coupled with Atomic Force Microscopy was used to study stiffness, hardness, and the reduced Young’s modulus of reduced graphene oxide. Oxygen reduction on the graphene oxide sample was performed via LightScribe DVD burner reduction, a cost-effective approach with potential for large scale graphene production. The reduction of oxygen in the graphene oxide sample was estimated to about 10 percent using FTIR spectroscopic analysis. Images of the various samples were captured after each reduction cycle using Atomic Force Microscopy. Elastic and spectroscopic analyses were performed on the samples after each oxygen reduction cycle in the LightScribe, thus allowing for a comparison of stiffness, hardness, and the reduced Young’s modulus based on the number of reduction cycles. The highest values obtained were after the fifth and final reduction cycle, yielding a stiffness of 22.4 N/m, a hardness of 0.55 GPa, and a reduced Young’s modulus of 1.62 GPa as compared to a stiffness of 22.8 N/m, a hardness of 0.58 GPa, and a reduced Young’s modulus of 1.84 GPa for a commercially purchased graphene film made by CVD. This data was then compared to the expected values of pristine single layer graphene. Furthermore, two RC circuits were built, one using a parallel plate capacitors made of light scribed graphene on a kapton substrate (LSGC) and a second one using a CVD deposited graphene on aluminum (CVDGC). Their RC time constants and surface charge densities were compared.

中文翻译：

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使用原子力显微镜对还原氧化石墨烯进行机械表征

纳米压痕结合原子力显微镜用于研究还原氧化石墨烯的刚度、硬度和降低的杨氏模量。通过 LightScribe DVD 刻录机还原对氧化石墨烯样品进行氧还原，这是一种具有大规模石墨烯生产潜力的具有成本效益的方法。使用 FTIR 光谱分析估计氧化石墨烯样品中的氧减少了约 10%。使用原子力显微镜在每个还原循环后捕获各种样品的图像。在 LightScribe 中的每个氧还原循环之后，对样品进行弹性和光谱分析，从而可以比较刚度、硬度和基于还原循环次数的降低杨氏模量。获得的最高值是在第五次也是最后一次还原循环之后，刚度为 22.4 N/m，硬度为 0.55 GPa，杨氏模量降低为 1.62 GPa，而刚度为 22.8 N/m，硬度为0.58 GPa，商业购买的通过 CVD 制造的石墨烯薄膜的杨氏模量降低了 1.84 GPa。然后将该数据与原始单层石墨烯的预期值进行比较。此外，还构建了两个 RC 电路，一个使用由聚酰亚胺衬底 (LSGC) 上的光刻划石墨烯制成的平行板电容器，另一个使用铝上 CVD 沉积石墨烯 (CVDGC)。比较了它们的 RC 时间常数和表面电荷密度。对于商业购买的通过 CVD 制成的石墨烯薄膜，硬度为 0.58 GPa，杨氏模量降低为 1.84 GPa。然后将该数据与原始单层石墨烯的预期值进行比较。此外，还构建了两个 RC 电路，一个使用由聚酰亚胺衬底 (LSGC) 上的光刻划石墨烯制成的平行板电容器，另一个使用铝上 CVD 沉积石墨烯 (CVDGC)。比较了它们的 RC 时间常数和表面电荷密度。对于商业购买的通过 CVD 制成的石墨烯薄膜，硬度为 0.58 GPa，杨氏模量降低为 1.84 GPa。然后将该数据与原始单层石墨烯的预期值进行比较。此外，还构建了两个 RC 电路，一个使用由聚酰亚胺衬底 (LSGC) 上的光刻划石墨烯制成的平行板电容器，另一个使用铝上 CVD 沉积石墨烯 (CVDGC)。比较了它们的 RC 时间常数和表面电荷密度。一种使用由聚酰亚胺衬底 (LSGC) 上的光刻划石墨烯制成的平行板电容器，另一种使用铝上 CVD 沉积石墨烯 (CVDGC)。比较了它们的 RC 时间常数和表面电荷密度。一种使用由聚酰亚胺衬底 (LSGC) 上的光刻划石墨烯制成的平行板电容器，另一种使用铝上 CVD 沉积石墨烯 (CVDGC)。比较了它们的 RC 时间常数和表面电荷密度。