Abstract The electrochemical behavior of gold dissolution in the Cu2+–NH3–S2O3 2−–EDTA solution has been investigated in detail by deriving and analyzing the Tafel polarization curve, as this method is currently widely implemented for the electrode corrosion analysis. The dissolution rate of gold in Cu2+–NH3–S2O3 2−–EDTA solution was determined based on the Tafel polarization curves, and the effects of various compound compositions in a Cu2+–NH3–S2O3 2−–EDTA mixture on the corrosion potential and corrosion current density were analyzed. The results showed that the corrosion potential and polarization resistance decreased, whereas the corrosion current density increased for certain concentrations of S2O3 2−–NH3–Cu2+ and EDTA, indicating that the dissolution rate of gold had changed. The reason for promoting the dissolution of gold is also discussed.

中文翻译：

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一种电化学方法研究化合物组成对硫代硫酸盐溶液中金溶解的影响

摘要 通过推导和分析 Tafel 极化曲线，详细研究了金在 Cu2+–NH3–S2O3 2-–EDTA 溶液中溶解的电化学行为，因为该方法目前广泛用于电极腐蚀分析。金在 Cu2+–NH3–S2O3 2––EDTA 溶液中的溶解速率是根据 Tafel 极化曲线确定的，以及 Cu2+–NH3–S2O3 2––EDTA 混合物中各种化合物组成对腐蚀电位和腐蚀的影响电流密度进行了分析。结果表明，在一定浓度的 S2O3 2-–NH3–Cu2+ 和 EDTA 下，腐蚀电位和极化电阻降低，而腐蚀电流密度增加，表明金的溶解速率发生了变化。还讨论了促进金溶解的原因。