Purpose

As in real applications several alternating current (AC) currents may be injected to the electronic devices, this study aims to analyze their effects on the lifetime of the solder joints and, consequently, shed the light on these effects at the design phase for other researchers to consider.

Design/methodology/approach

In this paper, the authors investigated on current waveform shapes on the performance and reliability of the solder joints in electronic package. Three common and extensively used current shapes in several simulations and experiments were selected to study their effects on the solder joint performance.

Findings

The results demonstrate a sever thermal swing and stress fluctuation in the solder joint induced in the case of triangle current type because the critical states lack any relaxation time. In fact, the stress intensification in the solder under application of the triangle current type has been shown to contribute to increasing brittle intermetallic compounds. An accelerated increase of on-state voltage of power semiconductor was also observed in under application of the triangle current type.

Originality/value

The originality of this paper is confirmed.

中文翻译：

---

电流类型对电子封装焊点退化的作用研究

目的

由于在实际应用中可能会向电子设备注入数个交流（AC）电流，所以本研究旨在分析它们对焊点寿命的影响，因此，在设计阶段为其他研究人员揭示了这些影响。考虑。

设计/方法/方法

在本文中，作者研究了电流波形形状对电子封装中焊点性能和可靠性的影响。在几种模拟和实验中，选择了三种常见且被广泛使用的电流形状，以研究它们对焊点性能的影响。

发现

结果表明，在三角形电流类型的情况下，由于临界状态缺少任何弛豫时间，在焊点中产生了严重的热摆幅和应力波动。实际上，在施加三角电流类型的情况下，焊料中的应力增强已显示出有助于增加脆性金属间化合物的作用。在使用三角电流型的情况下，还观察到功率半导体的导通电压的加速增加。

创意/价值

本文的原创性得到确认。