Abstract

The results of experimental investigations of the angular distributions during magnetron sputtering of Mg, Al, Si, Ti, Cr, Cu, Zn, Ge, Zr, Nb, Mo, Ag, In, Sn, W, Pt, Au, and Bi targets in argon at a constant current are presented. The operating conditions during the experiments corresponded to the values typical of industrial sputtering equipment. The angular distribution of the material flow was calculated based on the measured thickness of the coating deposited on two flexible ribbon substrates. These substrates were fixed in place on a substrate holder in the form of two crossed half-rings that were equidistant from the center of the magnetron target (the curvature radius was 100 mm). The influence of the magnitude and shape of the magnetic field near the surface of the sputtered cathode on the angular distribution was also investigated. The results can be used as the source data for calculating the profile of the coating during magnetron sputtering.

中文翻译：

---

磁控溅射多晶Mg，Al，Si，Ti，Cr，Cu，Zn，Ge，Zr，Nb，Mo，Ag，In，Sn，W，Pt，Au和Bi靶的磁控溅射过程中的角分布

摘要

Mg，Al，Si，Ti，Cr，Cu，Zn，Ge，Zr，Nb，Mo，Ag，In，Sn，W，Pt，Au和Bi靶磁控溅射过程中角度分布的实验研究结果给出了在氩气中恒流下的氩气。实验期间的操作条件对应于工业溅射设备的典型值。基于在两个柔性带状基材上沉积的涂层的测得厚度，计算材料流的角度分布。将这些基板以两个交叉的半环的形式固定在基板支架上，该两个环形的半环与磁控管靶材的中心等距（曲率半径为100 mm）。还研究了溅射阴极表面附近磁场的大小和形状对角度分布的影响。