Hard and brittle materials such as silicon and silicon carbide are widely used in aerospace and integrated circuit. They are often poorly machined owing to non-linearity in machining process and complexities in selecting suitable machining parameters and tool geometry. The experimental difficulty involved in observing nanoscale physical phenomena (i.e. in-process measurement problems, inaccessible contact area of tool and workpiece, and the difficulty of surface analysis) has led to the use of molecular dynamics (MD) and response surface methodology (RSM) to investigate effect of tool edge radius, rake and clearance angles on monocrystalline silicon in this research. The response of subsurface deformation depth (SSD), tool temperature, kinetic friction cutting and thrust forces to tool edge radius, rake and clearance angles showed that SSD increased as the rake angle, edge radius and clearance angle increased while kinetic friction reduced as they increased. The increase in SSD ...

中文翻译：

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单点金刚石旋转时单晶硅的纳米行为—分子动力学和响应面分析

诸如硅和碳化硅之类的硬而脆的材料被广泛用于航空航天和集成电路。由于加工过程中的非线性以及选择合适的加工参数和刀具几何形状的复杂性，它们通常加工不佳。观察纳米级物理现象（例如，过程中的测量问题，工具和工件的接触区域难以接近以及表面分析的困难）所涉及的实验困难导致了分子动力学（MD）和响应表面方法（RSM）的使用在这项研究中，研究刀刃半径，前角和间隙角对单晶硅的影响。地下变形深度（SSD），刀具温度，动摩擦切削力和推力对刀具边缘半径的响应，前角和后角表明，SSD随着前角，边半径和后角的增加而增加，而动摩擦则随着它们的增加而减小。SSD的增加...