Package-integrated and ultrathin power dividers with footprint smaller than unit $\lambda ~_{0}~^{\mathrm{ 2}}$ at the operating frequency of 28-GHz 5G new radio (NR) n257 and n258 bands are presented for the first time for small-cell applications. These power dividers are also configured as antenna arrays using endfire Yagi–Uda antenna elements. Utilizing minimal matching techniques, two-, three-, and four-element antenna arrays are designed without compromising on the bandwidth of operation or electrical performance. These thin-film power dividers exhibit a cross-sectional height of $147~\mu \text{m}$ and can be implemented in the top metal layer of front-end module packages. Panel-compatible semiadditive patterning (SAP) process is utilized to realize these structures, which yields precise line space dimensions required for millimeter-wave (mm-wave) applications. This results in power dividers with low added insertion loss, low VSWR, and minimal phase difference between output ports. The added insertion loss is 25% less than similar structures reported on integrated fan-out architectures. The antenna arrays exhibit high gain and efficiency. Excellent model-to-hardware correlation is observed with multiple coupons of the same structure. Package-integrated power dividers and antenna arrays based on ultrathin laminated glass substrate represent a major step toward realizing compact mm-wave antenna-in-package for 5G small-cell applications.

中文翻译：

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用于28 GHz 5G新无线电频段的封装集成式宽带功率分配网络和天线阵列

封装集成且超薄的功率分配器，占地面积小于单元 $ \ lambda〜_ {0}〜^ {\ mathrm {2}} $ 在28 GHz 5G的工作频率下，首次针对小型蜂窝应用推出了新的无线电（NR）n257和n258频段。这些功率分配器还使用端射Yagi–Uda天线元件配置为天线阵列。利用最少的匹配技术，设计了两个，三个和四个元素的天线阵列，而不会影响工作或电气性能的带宽。这些薄膜功率分配器的横截面高度为 $ 147〜\ mu \ text {m} $ 并可以在前端模块封装的顶部金属层中实现。利用面板兼容的半添加图案（SAP）工艺来实现这些结构，从而产生毫米波（mm-wave）应用所需的精确线空间尺寸。这导致功率分配器具有较低的插入损耗，较低的VSWR，并且输出端口之间的相位差最小。与集成扇出架构上报告的类似结构相比，增加的插入损耗小25％。天线阵列表现出高增益和效率。使用相同结构的多个优惠券，可以观察到极好的模型与硬件的相关性。基于超薄夹层玻璃基板的集成封装功率分配器和天线阵列是实现面向5G小蜂窝应用的紧凑型毫米波封装天线的重要一步。