In this work, we developed a process to release the optical waveguides locally from the back side of a silicon-on-insulator wafer to enable a connection and an interaction between organic materials and photonic devices. The release procedure is realized by a local back-side etch followed by a chemical wet etch. Furthermore, certain process steps for a controlled removal of the buried oxide below the silicon device layer are introduced to protect the back end of line (BEOL) and to guarantee a compatibility with a photonic integrated circuit (PIC) technology. The presented approach gives perspective to a hybrid integration of organic materials into a PIC technology with a full BEOL for high-speed silicon-organic hybrid modulators and label-free biosensors.

中文翻译：

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槽式波导的背面版本，用于将功能材料集成到具有完整BEOL的硅光子技术中

在这项工作中，我们开发了一种从绝缘体上硅晶片的背面局部释放光波导的工艺，以实现有机材料与光子器件之间的连接和相互作用。释放过程是通过局部背面蚀刻，然后进行化学湿蚀刻来实现的。此外，引入了用于可控地去除硅器件层下方的掩埋氧化物的某些工艺步骤，以保护线路的后端（BEOL）并确保与光子集成电路（PIC）技术的兼容性。提出的方法为将有机材料混合集成到具有完整BEOL的PIC技术中提供了前景，该BEOL用于高速硅有机混合调制器和无标记生物传感器。