Cu-5.8vol.-%TiB2 composites reinforced with different sized TiB2 particles were prepared by spark plasma sintering (SPS). The arc erosion resistance was examined using a JF04C electrical contact instrument. The results indicate that the TiB2 particle size and contact currents have important effects on the material transfer mode. Both lower mass loss and relative mass transfer was observed in the Cu-5.8vol.-%TiB2 composites reinforced with fine TiB2 particles (10 um, 30 um) compared to those with coarse TiB2 particles (70 um, 110 um). The investigation and analysis of the microstructure and arc erosion mechanism show uniform distribution of fine TiB2 particles in the copper matrix can significantly improve the viscosity of the molten pool and decrease the splashing of molten Cu.

中文翻译：

---

TiB2粒径对Cu-TiB2复合材料材料转移行为的影响

Cu-5.8vol.-%TiB2 复合材料由不同尺寸的 TiB2 颗粒增强由放电等离子烧结 (SPS) 制备。使用JF04C电接触仪检测耐电弧侵蚀性。结果表明，TiB2 粒径和接触电流对材料转移模式有重要影响。与粗 TiB2 颗粒（70 um、110 um）相比，在用细 TiB2 颗粒（10 um、30 um）增强的 Cu-5.8vol.-% TiB2 复合材料中观察到较低的质量损失和相对传质。微观组织和电弧侵蚀机理的研究和分析表明，细小的 TiB2 颗粒在铜基体中的均匀分布可以显着提高熔池的粘度并减少熔融铜的飞溅。