A conductive Cu thin film with a thickness of 170[Formula: see text]nm, electrical resistivity of 8.9(2) [Formula: see text][Formula: see text]cm and adhesion strength of 12(7) MPa was fabricated at 180∘C in air. The spray solutions were prepared by electrolyzing Cu electrodes in an aqueous solution of ammonium formate, and then by adding ethylenediamine-N, N, N[Formula: see text], N[Formula: see text]-tetraacetic acid (EDTA). The surface morphology image of resultant Cu thin film, observed by a field emission scanning electron microscope, revealed Cu grains with particle sizes of ca. [Formula: see text][Formula: see text]nm. It was indicated that the Cu complex containing EDTA ligand in the spray solution plays important roles to (1) provide enough amount of carbon atoms as a reducing agent for phase transition of its coordinated Cu[Formula: see text] to crystalline Cu0 and (2) prevent the product from oxidation under atmospheric O2 during spray coating.

中文翻译：

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在石英玻璃基板上在空气中于 180°C 选择性沉积 p 型 Cu2O 或导电 Cu 薄膜：使用两室电解系统开发水喷雾溶液

制备厚度为 170[公式：见正文]nm、电阻率为 8.9(2) [公式：见正文][公式：见正文]cm、粘附强度为 12(7) MPa 的导电铜薄膜180∘C 在空气中。通过在甲酸铵水溶液中电解Cu电极，然后加入乙二胺-N、N、N[分子式：见正文]、N[分子式：见正文]-四乙酸（EDTA）制备喷雾溶液。通过场发射扫描电子显微镜观察所得铜薄膜的表面形态图像，显示粒径约为 1 的铜晶粒。[公式：见正文][公式：见正文]nm. 表明喷雾溶液中含有 EDTA 配体的 Cu 配合物对 (1) 提供足够量的碳原子作为还原剂，使其配位的 Cu [分子式：见正文] 相转变为结晶 Cu0(2) 防止产品在大气 O 下氧化2在喷涂过程中。