This study proposes a technique for determining a tool–chip thermal conductance coefficient and heat flux in machining. The technique is based on solving an inverse heat transfer problem (IHTP). Because the IHTP is ill-posed, a priori information is required for its effective solution. To derive this information, substantial qualitative and quantitative analysis of a mixed boundary value problem for the heat equation and an illustrative test case for IHTP are provided. It has been established that the averaged interfacial chip temperature is needed for an effective IHTP solution. Thermal imaging combined with a special experimental setup was used to determine chip temperature. It was also found that a function describing the heat flux time dependency belongs to a set of decreasing functions.

Tool–chip thermal conductance coefficients were obtained for high-speed steel and cemented carbide tooling. On the microscale, this data was interpreted in terms of a conforming rough surface contact conductance model, where tool wear was found to govern variations in the thermal conductance coefficient.

这项研究提出了一种确定加工中刀具-芯片导热系数和热通量的技术。该技术基于解决逆传热问题（IHTP）。由于IHTP不适，因此需要先验信息才能有效解决。为了获得该信息，提供了热方程的混合边值问题的实质性定性和定量分析，以及IHTP的说明性测试案例。已经确定，有效的IHTP解决方案需要平均界面芯片温度。使用热成像结合特殊的实验设置来确定芯片温度。还发现描述热通量时间依赖性的函数属于一组递减函数。

获得了高速钢和硬质合金刀具的刀具-芯片导热系数。在微观尺度上，这些数据是根据一个符合标准的粗糙表面接触电导模型来解释的，在该模型中，发现工具磨损决定了导热系数的变化。