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Interfacial coupling effects on the thermal conductivity of few-layer graphene
Materials Research Express ( IF 1.8 ) Pub Date : 2020-09-18 , DOI: 10.1088/2053-1591/abb69c
Yajing Kan , Feng Hong , Zhiyong Wei , Kedong Bi

The thermal conductivities of both suspended and supported few-layer graphene (FLG) were investigated via molecular dynamics simulations. The results indicate that the thermal conductivity of a suspended FLG sample decreases by 3.9% from 511.2 W m −1 K −1 upon an increase in the number of layers from 1 to 20 layers, whereas it increases by 5.5% to 486.8 W m −1 K −1 in the case of supported FLG specimens on a smooth crystalline silicon surface. Both trends converge when the number of layers is higher than five. The effects of the substrate roughness on the supported FLG samples were also investigated. The results show that their thermal conductivity on a rough silicon surface is lower than that on a smooth silicon surface. In order to demonstrate the importance of interfacial coupling on the phonon transport properties, the coupling strength parameter was enhanced by a factor of 3 or 10 to see the influence on the thermal conductivity. The ...

中文翻译:

界面耦合对多层石墨烯导热系数的影响

通过分子动力学模拟研究了悬浮的和支撑的多层石墨烯(FLG)的热导率。结果表明,随着层数从1层增加到20层,悬浮的FLG样品的热导率从511.2 W m -1 K -1降低3.9%,而增加5.5%至486.8 W m-在光滑的结晶硅表面上支撑的FLG试样为1 K -1。当层数大于五时,这两种趋势会收敛。还研究了基材粗糙度对负载的FLG样品的影响。结果表明,它们在粗糙的硅表面上的导热率低于在光滑的硅表面上的导热率。为了证明界面耦合对声子传输特性的重要性,耦合强度参数提高了3或10倍,以查看其对热导率的影响。的...
更新日期:2020-09-20
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