Solid-State Electronics ( IF 1.4 ) Pub Date : 2020-09-18 , DOI: 10.1016/j.sse.2020.107898 Miguel A. Domínguez , José L. Sosa-Sánchez
In this work, the use of sublimated copper phthalocyanine (CuPc) organic thin films as a buffer interlayer in aluminum tracks on paper is presented for the first time. The CuPc was synthetized using a new eco-friendly synthetic protocol and the higher purity of the product turn out to be useful for the set forth applications. With the use of the CuPc buffer interlayer it is possible to enable paper substrates as printed circuit boards and as dielectric material for flexible electronic devices. The connectivity of the aluminum tracks was evaluated when the paper substrate is bent several times and after ten months of storage at ambient conditions. In addition, the aluminum tracks exhibit reliable current driving capabilities to turn-on a LED device. Finally, the fabrication of a hybrid touch sensor on paper is demonstrated.
中文翻译:
铜酞菁缓冲中间膜,用于印刷电路板和柔性电子设备的电介质中
在这项工作中,首次提出了将升华的铜酞菁(CuPc)有机薄膜用作纸上铝迹线的缓冲中间层。使用新的环保合成协议合成了CuPc,事实证明该产品的更高纯度对上述应用很有用。通过使用CuPc缓冲夹层,可以使纸质基材作为印刷电路板和挠性电子设备的介电材料。当纸质基材弯曲几次并在环境条件下存放10个月后,评估铝轨的连通性。此外,铝轨具有可靠的电流驱动能力,可以打开LED器件。最后,演示了在纸上混合触摸传感器的制造。