Abstract With the decrease of feature size of integrated circuits, higher requirements are put forward for the surface defects of copper interconnects after chemical mechanical polishing (CMP). Colloidal SiO2 is used as a common abrasive in the CMP slurry for copper interconnect, which is the main contaminant in the post-CMP cleaning process. The interaction parameters of the anionic surfactant Dodecylbenzenesulfonic acid (LABSA) and the nonionic surfactant fatty alcohol polyethylene ether (JFCE) were calculated. It was determined that when the ratio of LABSA/JFCE compound was 2:3 and the concentration was 1000 ppm, the synergistic effect of the two surfactants was the strongest. The effect of the composite surfactant on the particle removal was verified by scanning electron microscopy (SEM). When the compound ratio of LABSA and JFCE is 2:3, the maximum removal efficiency of particles on copper surface was 97.08%. The reactive sites of LABSA and JFCE were studied at B3LYP/6-31G (d,p) level. Their adsorption energies on copper surface were calculated. It was concluded that under the action of composite surfactant agent, the SiO2 particles physically adsorbed on the copper surface could be easily desorbed. The theoretical analysis is consistent with the experimental results; the compound cleaning solution is suitable for particle removal in post CMP cleaning.

中文翻译：

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LABSA/JFCE复合表面活性剂体系对铜晶片表面颗粒去除的协同作用

摘要 随着集成电路特征尺寸的减小，对化学机械抛光（CMP）后的铜互连表面缺陷提出了更高的要求。胶体 SiO2 用作铜互连的 CMP 浆料中的常见磨料，它是 CMP 后清洁过程中的主要污染物。计算了阴离子表面活性剂十二烷基苯磺酸（LABSA）和非离子表面活性剂脂肪醇聚乙烯醚（JFCE）的相互作用参数。确定当LABSA/JFCE复合物的比例为2:3，浓度为1000 ppm时，两种表面活性剂的协同作用最强。通过扫描电子显微镜（SEM）验证了复合表面活性剂对颗粒去除的影响。当LABSA与JFCE的复合比为2:3时，铜表面颗粒的最大去除效率为97.08%。在 B3LYP/6-31G (d,p) 水平上研究了 LABSA 和 JFCE 的反应位点。计算了它们在铜表面的吸附能。结论是在复合表面活性剂的作用下，物理吸附在铜表面的SiO2颗粒很容易解吸。理论分析与实验结果一致；该复合清洗液适用于CMP后清洗中的颗粒去除。物理吸附在铜表面的 SiO2 颗粒很容易解吸。理论分析与实验结果一致；该复合清洗液适用于CMP后清洗中的颗粒去除。物理吸附在铜表面的 SiO2 颗粒很容易解吸。理论分析与实验结果一致；该复合清洗液适用于CMP后清洗中的颗粒去除。