Detailed knowledge of correlations between direct current (DC) cathodic arc deposition process parameters, plasma properties, and the microstructure of deposited coatings are essential for a comprehensive understanding of the DC cathodic arc deposition process. In this study we have probed the plasma, generated by DC arc on a Ti-50 at.% Al cathode in a N 2 ambience, at the growth front of the TiAlN coating. Several consequences of an increasing N 2 pressure are observed, including a decreased electron temperature, an increased electron density, and a loss of energetic ions. As a result, the preferred growth texture switches from 220 to 111. It is also observed that neutrals in the plasma can significantly contribute to the growth of TiAlN coatings.

中文翻译：

---

N 2压力变化对TiAlN涂层直流电弧等离子体性能和微观结构的影响

直流（DC）阴极电弧沉积工艺参数，等离子体特性和沉积涂层微观结构之间的相关关系的详细知识对于全面了解DC阴极电弧沉积工艺至关重要。在这项研究中，我们已经探究了在TiAlN涂层的生长前沿处，在N 2气氛下在Ti-50 at。％Al阴极上由直流电弧产生的等离子体。观察到N 2压力增加的几种后果，包括电子温度降低，电子密度增加和高能离子损失。结果，优选的生长织构从220变为111。还可以观察到，等离子体中的中性物质可以显着促进TiAlN涂层的生长。