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Heterogeneous Compound Semiconductor Integration
Physica Status Solidi (A) - Applications and Materials Science Pub Date : 2020-09-15 , DOI: 10.1002/pssa.202000394 Ronald S. Cok 1 , David Gomez 1
Physica Status Solidi (A) - Applications and Materials Science Pub Date : 2020-09-15 , DOI: 10.1002/pssa.202000394 Ronald S. Cok 1 , David Gomez 1
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Micro‐transfer printing (μTP) provides fast and precise assembly of micro‐components from a variety of different source materials onto non‐native target substrates such as glass, plastic, ceramic, and silicon. Retrievable micro‐components are picked up by an elastomer stamp and printed onto the target substrate with yields exceeding 99.9%. Devices incorporating GaN, GaAs, InP, and other compound semiconductor materials are successfully integrated onto silicon and glass with fine precision to make highly integrated compound semiconductor micro‐systems.
中文翻译：
异构化合物半导体集成
微转移印刷（μTP）可将来自多种不同来源的微组件快速准确地组装到非本机目标基材上，例如玻璃，塑料，陶瓷和硅。可回收的微组分通过弹性体印章拾取，并印刷到目标基材上，产率超过99.9％。结合了GaN，GaAs，InP和其他化合物半导体材料的器件已成功地以极高的精度集成到硅和玻璃上，从而形成了高度集成的化合物半导体微系统。
更新日期：2020-09-15
中文翻译：
异构化合物半导体集成
微转移印刷（μTP）可将来自多种不同来源的微组件快速准确地组装到非本机目标基材上，例如玻璃，塑料，陶瓷和硅。可回收的微组分通过弹性体印章拾取，并印刷到目标基材上，产率超过99.9％。结合了GaN，GaAs，InP和其他化合物半导体材料的器件已成功地以极高的精度集成到硅和玻璃上，从而形成了高度集成的化合物半导体微系统。
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