Simultaneously Improving Dielectric and Mechanical Properties of Crown Ether/Fluorinated Polyimide Films with Necklace‐Like Supramolecular Structure,Macromolecular Chemistry and Physics

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Simultaneously Improving Dielectric and Mechanical Properties of Crown Ether/Fluorinated Polyimide Films with Necklace‐Like Supramolecular Structure
Macromolecular Chemistry and Physics ( IF 2.5 ) Pub Date : 2020-09-16 , DOI: 10.1002/macp.202000256
Shumei Liu _{1,

2} , Qi Feng ₁ , Yang Li ₁ , Zhigeng Chen _{1,

2} , Jianqing Zhao _{1,

2}

Affiliation

A necklace‐like supramolecular structure is constructed from 18‐crown ether‐6 (18CE6) as the host molecule and fluorinated polyimide (FPI) as the guest molecule to enhance the mechanical properties as well as to further lower the dielectric constant of FPI. The introduction of 18CE6 simultaneously enhances the stiffness and toughness of FPI films. In particular, the elongation at break is increased by over 200%. Furthermore, the dielectric constant of FPI films with 40 mol% 18CE6 is decreased to 2.74 from 3.15 of pure FPI, which is attributed to the enlarged free volume by the necklace‐like supramolecular structure of 18CE6/FPI. Accordingly, the glass transition temperature of 18CE6/FPI films is slightly reduced to 305 °C, which is still high enough during the soldering process for the preparation of flexible copper clad laminate. In addition, the water absorption of FPI films is gradually decreased to 0.52% as the loading of 18CE6 raises to 40 mol%, representing the excellent moisture resistance of 18CE6/FPI films.

中文翻译：

同时改善具有类似项链的超分子结构的冠醚/氟化聚酰亚胺薄膜的介电和机械性能

项链状的超分子结构由18冠醚-6（18CE6）作为主体分子和氟化聚酰亚胺（FPI）作为客体分子构成，以增强机械性能并进一步降低FPI的介电常数。18CE6的引入同时增强了FPI薄膜的刚度和韧性。特别是，断裂伸长率增加了200％以上。此外，具有40 mol％18CE6的FPI薄膜的介电常数从纯FPI的3.15降低到2.74，这归因于18CE6 / FPI的项链状超分子结构增加了自由体积。因此，将18CE6 / FPI薄膜的玻璃化转变温度略微降低至305°C，这在焊接过程中仍足够高，可用于制备柔性覆铜层压板。此外，

更新日期：2020-10-19

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